WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 26, 2024
app pub date -
Jun 2, 2022
filing date -
Jun 2, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The present disclosure provides a wiring substrate, a manufacturing method thereof, a light-emitting substrate, a display device. The wiring substrate includes a base substrate including a functional region and a bonding region, a first conductive layer at least in the functional region; a second conductive layer that is on the first conductive layer and at least in the functional region and connected to the first conductive layer; a first insulating layer on the second conductive layer and including a main part and an opening. At least one of the first and second conductive layers includes multiple electrodes in the bonding region and extending along a first direction, each electrode includes a first end adjacent to the functional region in the first direction, an orthographic projection of the main part on the base substrate at least partially overlaps with an orthographic projection of the first end on the base substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully