PRECLEAN AND ENCAPSULATION OF MICROLED FEATURES
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Jun 6, 2024
filing date -
May 26, 2020
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Abstract
Method for cleaning and encapsulating microLED features are disclosed. Some embodiments provide for a wet clean process and a dry clean process to remove contaminants from the microLED feature. Some embodiments provide for the encapsulation of a clean microLED feature. Some embodiments provide improved crystallinity of the microLED feature and the capping layer. Some embodiments provide improved EQE of microLED devices formed from the disclosed microLED features.
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