SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240321977A1
SERIAL NO

18455993

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a first semiconductor layer, a second semiconductor layer, a first electrode, a second electrode, a conductive part, an insulating part, and a third electrode. The second semiconductor layer is located on the first semiconductor layer. The first electrode is located on the second semiconductor layer. The first electrode includes an electrode part and an electrode extension part. The electrode part contacts the second semiconductor layer. The electrode extension part extends from an upper end portion of the electrode part. The conductive part is positioned between the first electrode and the second electrode. The conductive part contacts an upper surface of the second semiconductor layer and contacting the first electrode. The insulating part is located on the conductive part and is positioned between the conductive part and the electrode extension part.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBATOKYO
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUNG, Hung Kawasaki Kanagawa, JP 61 130
ISOBE, Yasuhiro Narashino Chiba, JP 53 566
KOBAYASHI, Hitoshi Yamato Kanagawa, JP 190 2275
SEKIGUCHI, Hideki Yokohama Kanagawa, JP 54 484
SUGIYAMA, Toru Musashino Tokyo, JP 138 1630
YOSHIOKA, Akira Yokohama Kanagawa, JP 105 590

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