SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Mar 13, 2024
filing date -
Mar 23, 2023
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Abstract
According to certain aspects, a packaging substrate can include a plurality of layers including an outer layer, and one or more components on a surface of the outer layer. The one or more components can include a radio-frequency circuit, where the radio-frequency circuit is covered by a protective coating configured to reduce surface roughness of the outer layer and not covered by solder resist.
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