INTERPOSER WITH LINES HAVING PORTIONS SEPARATED BY BARRIER LAYERS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240321760A1
SERIAL NO

18369310

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Interposers and methods for making interposers having a substrate having a surface defining a plane; a first portion of a metal line directly or indirectly supported by the substrate; a barrier layer on the first portion of the metal line; a second portion of the metal line on the first barrier layer, wherein the second portion is opposite the first portion across the barrier layer. The method includes etching a line pattern in a first portion of a metal layer through a first photoresist layer to form a first portion of a metal line, depositing a barrier layer on the first portion of the metal line, and etching a line pattern in a second portion of the metal layer through a second photoresist layer to form a second portion of a metal line wherein the second portion is opposite the first portion across the barrier layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MICROCHIP TECHNOLOGY INCORPORATED2355 WEST CHANDLER BLVD CHANDLER AS 85224-6199

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Bomy Newark, US 90 1658
Nagel, Steve Chandler, US 3 0

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation