Packaged Device, Power Module, and Electronic Apparatus
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Jun 6, 2024
filing date -
Jan 25, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
An outer surface of a packaged device includes a bottom surface and a plurality of side surfaces. The bottom surface of the packaged device faces a circuit board, and an area of at least one side surface is greater than that of the bottom surface. The packaged device includes a chip module, a package body, a first interface, and a second interface. The first interface of the packaged device is configured to connect to the circuit board. The second interface of the packaged device is configured to connect to a surface-mount device, and is disposed on at least one side surface.
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