WAFER POD TRANSFER ASSEMBLY

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United States of America Patent

APP PUB NO 20240321616A1
SERIAL NO

18731701

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHI, Yuan-Hsin Taichung City, TW 25 3
CHOU, Chih-Wei Taipei City, TW 21 21
CHOU, Yin-Tun Hsinchu City, TW 20 4
LIN, Sheng-Yuan Hsinchu, TW 45 508
LIU, Yu-Chi Taoyuan County, TW 16 2
WANG, Hung-Chih Taichung City, TW 40 148

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