WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR

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United States of America Patent

APP PUB NO 20240321483A1
SERIAL NO

18538822

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Abstract

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A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jaehoon Suwon-si, KR 90 386
Song, Hyun-Ji Suwon-si, KR 33 89

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