PROCESS PROXIMITY CORRECTION METHOD BASED ON DEEP LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD COMPRISING THE PROCESS PROXIMITY CORRECTION METHOD
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Oct 23, 2023
filing date -
Mar 24, 2023
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Abstract
A deep learning-based process proximity correction method includes receiving a first layout associated with an After Cleaning Inspection (ACI), the first layout including a plurality of patterns associated with manufacturing a semiconductor device, generating a predictive model based on the plurality of patterns, through deep learning, generating a layout associated with an After Development Inspection (ADI) by correcting the first layout, and predicting an ACI using the layout of ADI, through the predictive model.
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