SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM

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United States of America Patent

APP PUB NO 20240319707A1
SERIAL NO

18596844

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Abstract

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There is provided a technique that includes: a substrate processor configured to process a substrate according to a recipe including at least one step defining a substrate processing condition; an operator configured to receive an editing operation for at least one setting item included in the substrate processing condition; a calculator configured to calculate a control value for a setting value of the at least one setting item in conformity with an edited substrate processing condition obtained by the editing operation; and a controller configured to be capable of controlling a displayer to display time-series data of the control value calculated by the calculator together with information about the at least one step.

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Patent Owner(s)

Patent OwnerAddress
KOKUSAI ELECTRIC CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ekko, Hiroshi Toyama-shi, JP 7 23
Mitsui, Hiroyuki Toyama-shi, JP 71 750
Mori, Shinichiro Toyama-shi, JP 99 1130
TAKATA, Kyo Toyama-shi, JP 1 0
Yamaoka, Yuji Toyama-shi, JP 20 123

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