Optical Lithography System and Method of Using the Same

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United States of America Patent

APP PUB NO 20240319609A1
SERIAL NO

18733146

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Abstract

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In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MFG CO LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuo, Hung-Jui Hsinchu, TW 427 1983
Lee, Ming-Tan Kaohsiung, TW 34 41
Yu, Ting-Yang Hsinchu, TW 6 4

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