PROCESS PROXIMITY CORRECTION METHOD BASED ON MACHINE LEARNING, OPTICAL PROXIMITY CORRECTION METHOD INCLUDING THE SAME, AND METHOD OF MANUFACTURING MASK BY USING THE PROCESS PROXIMITY CORRECTION METHOD

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United States of America Patent

APP PUB NO 20240319580A1
SERIAL NO

18529781

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Abstract

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The present disclosure relates to process proximity correction (PPC) methods based on machine learning (ML), optical proximity correction (OPC) methods, and mask manufacturing methods including the PPC methods. One example PPC method based on ML includes obtaining a pattern gauge-based bottom critical dimension (CD) and obtaining pattern gauge-based features from a first layout, performing a gauge clustering operation of grouping and classifying pattern gauges including similar features, calculating distribution parameters in a skew-normal distribution of the pattern gauge-based bottom CD in each cluster, performing ML between the distribution parameters and a feature in each cluster to generate a prediction ML model, predicting a distribution, a maximum limit, and a minimum limit of the pattern gauge-based bottom CD by using the prediction ML model, generating an after cleaning inspection (ACI) target including a maximum process window, and generating a second layout by performing an development inspection (ADI) retarget operation.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU GYEONGGI-DO SUWON-SI 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gu, Bonhyun Suwon-si, KR 2 0
Jeong, Jaeyong Suwon-si, KR 77 690
Lee, Sooyong Suwon-si, KR 23 13

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