CHIP AND OPTICAL COMMUNICATION DEVICE
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United States of America Patent
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Sep 26, 2024
app pub date -
Jun 5, 2024
filing date -
Dec 6, 2021
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Abstract
An example chip may include a substrate, an insulation layer located on a side of the substrate, and a first waveguide and a second waveguide that are in the insulation layer. The second waveguide is located on a side of the first waveguide away from the substrate. A transmission loss of the second waveguide is smaller than a transmission loss of the first waveguide. A first coupling portion of the first waveguide and a second coupling portion of the second waveguide form a first coupling structure, and the first coupling structure is configured to implement optical coupling between the first waveguide and the second waveguide.
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