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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
CORNING INCORPORATED	SP-TI-3-1 CORNING NY 14831

International Classification(s)

• C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
• G02B:OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• 2024 Application Filing Year
• C03C Class
• 397 Applications Filed
• 17 Patents Issued To-Date
• 4.29 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Brusberg, Lars Martin Otfried	Corning, US	23	94
# of filed Patents : 23 Total Citations : 94
Kim, Jin Su	Seoul, KR	139	951
# of filed Patents : 139 Total Citations : 951
Zakharian, Aramais Robert	Painted Post, US	29	148
# of filed Patents : 29 Total Citations : 148

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• 0 Citation Count
• C03C Class

• 0 % this patent is cited more than
• 1 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Mar 26, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Mar 26, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 26, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
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Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2024/0319,458

INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME

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Abstract

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Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.

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Description

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Claims

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