HEAT PUMP SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240318879A1
SERIAL NO

18736015

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat pump system in which a heat source is air, and may include: a compressor configured to compress a refrigerant, a first heat exchanger configured to exchange heat between the refrigerant and air, a second heat exchanger configured to exchange heat between the refrigerant and water, a first refrigerant pipe configured to discharge the refrigerant heat exchanged in the first heat exchanger during a defrosting operation for the first heat exchanger, and a second refrigerant pipe configured to guide the refrigerant from the first refrigerant pipe to the second heat exchanger. The heat pump system may further include: a third refrigerant pipe configured to discharge the refrigerant heat exchanged in the second heat exchanger after flowing into the second heat exchanger through the second refrigerant pipe, a first water pipe configured to supply water to be heat exchanged in the second heat exchanger, a second water pipe configured to return the water heat exchanged in the second heat exchanger, a bypass pipe connecting the first refrigerant pipe and the third refrigerant pipe and configured to bypass the second heat exchanger, and a third heat exchanger configured to heat exchange the refrigerant guided by the bypass pipe with the water flowing in the second water pipe, during the defrosting operation.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
PYO, Soonjae Suwon-si, KR 3 0

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