PHOTOIMAGABLE DIELECTRICS
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Mar 21, 2023
filing date -
Mar 21, 2023
priority date (Note) -
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Abstract
There is provided a soluble polyimide resin comprising: (a) one or more tetracarboxylic acid component residues: (b) one or more diamine component residues; and (c) one or more endcapping compounds; wherein: the one or more endcapping compounds comprise one or more crosslinking groups. The soluble polyimide resin can be used in electronics applications.
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