THREE DIMENSIONAL MODELING METHOD AND THREE DIMENSIONAL MODELING APPARATUS
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United States of America Patent
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Issued Date -
Sep 26, 2024
app pub date -
Mar 6, 2024
filing date -
Mar 20, 2023
priority date (Note) -
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Abstract
A three dimensional modeling method for fabricating a modeled object having a cavity therein is disclosed. The three dimensional modeling method includes modeling the modeled object with first powder, the modeled object including an opening connecting the cavity and an outside of the modeled object; filling the cavity with second powder from the opening; sintering the modeled object whose cavity has been filled with the second powder in the filling; and removing the second powder in the cavity from the opening.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | A | JP2024134506 | Nov 24, 2023 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
Published unexamined patent application | 立体造形方法及び立体造形装置 | Oct 03, 2024 | |||
EP | A1 | EP4442390 | Feb 29, 2024 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | THREE DIMENSIONAL MODELING METHOD AND THREE DIMENSIONAL MODELING APPARATUS | Oct 09, 2024 | |||
CN | A | CN118663924 | Mar 06, 2024 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Three-dimensional modeling method and three-dimensional modeling device | Sep 20, 2024 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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RICOH COMPANY LTD | TOKYO 143-8555 |
International Classification(s)

- 2024 Application Filing Year
- B22F Class
- 492 Applications Filed
- 20 Patents Issued To-Date
- 4.07 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hayakawa, Shota | Kanagawa, JP | 10 | 37 |
# of filed Patents : 10 Total Citations : 37 | |||
SUN, Yunsheng | Telford, GB | 10 | 4 |
# of filed Patents : 10 Total Citations : 4 | |||
Tsuji, Masato | Kanagawa, JP | 47 | 457 |
# of filed Patents : 47 Total Citations : 457 |
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Patent Citation Ranking
- 0 Citation Count
- B22F Class
- 0 % this patent is cited more than
- 1 Age
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3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 26, 2028 |
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