PACKAGING SUBSTRATES HAVING RINGLESS VIAS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 19, 2024
app pub date -
Mar 13, 2024
filing date -
Mar 17, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
According to certain aspects, devices and methods can be provided for forming packaging substrates having ringless vias. For instance, a method of forming one or more vias in a packaging substrate can include: laminating a plurality of layers of a packaging substrate; drilling a via hole through the plurality of layers using a through drill, the plurality of layers not including a capture pad or ring along a path of the through drill for drilling the via hole; and forming a via in the via hole using a plating process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully