INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 19, 2024
app pub date -
Mar 13, 2023
filing date -
Mar 13, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Embodiments disclosed herein include a multi-die module. In an embodiment, the multi-die module comprises an interposer, where the interposer comprises a first region and a second region. In an embodiment, the first region is spaced apart from the second region by a saw street. In an embodiment, a first die is over the interposer, where the first die is positioned over the saw street. In an embodiment, a second die is adjacent to a first end of the first die, and a third die is adjacent to a second end of the first die opposite from the first end.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully