THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 19, 2024
app pub date -
May 24, 2024
filing date -
Nov 26, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
An integrated circuit includes a semiconductor substrate. The integrated circuit also includes a trench in the semiconductor substrate, the trench including a layer of a nanoparticle material. The integrated circuit further includes an interconnect region above the trench.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully