LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT

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United States of America Patent

APP PUB NO 20240312854A1
SERIAL NO

18603969

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a laminated structure suitable for semiconductor elements.

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Patent Owner(s)

Patent OwnerAddress
FLOSFIA INCKYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ANDO, Hiroyuki Kyoto, JP 111 1041
KATO, Yuji Kyoto, JP 125 1478
TSUKAMOTO, Naoyuki Kyoto, JP 12 24

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