SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
May 22, 2024
filing date -
Dec 31, 2019
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Abstract
A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.
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