PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
May 29, 2024
filing date -
Jul 14, 2020
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Abstract
A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.
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