ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
Feb 1, 2024
filing date -
Mar 17, 2023
priority date (Note) -
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Abstract
An electronic component includes: an element body having a main surface as a mounting surface; and a pair of external electrodes including an electrode layer embedded inside an opening of the element body and a plating layer formed on the electrode layer, in a first direction perpendicular to the main surface, a main surface of the electrode layer is disposed deeper inside the element body than a virtual plane obtained by virtually extending the main surface in the opening, and the plating layer is formed on the main surface of the electrode layer and covers the electrode layer so as to extend from the virtual plane to a main surface of the element body.
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