ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240309247A1
SERIAL NO

18628941

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

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Patent Owner(s)

Patent OwnerAddress
3M INNOVATIVE PROPERTIES COMPANYST PAUL MN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Jeongwan Suwon-Si, KR 23 101
Kaplun, Marina M Woodbury, US 12 29
Kim, Jinbae Ansan, KR 18 29
McCutcheon, Jeffrey W Baldwin, US 45 831
Yu, Steven Y St. Paul, US 21 194

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