NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
Jul 8, 2022
filing date -
Jul 14, 2021
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Abstract
A polymer, resin composition containing the same, and a molded body thereof, having excellent heat resistance and dielectric properties, capable of being dissolved in an organic solvent at a high concentration, and having excellent compatibility with other thermoplastic resins and thermosetting resins, which polymer has a repeating unit derived from a polymerizable compound of formula (I) and a repeating unit derived from a polymerizable compound of formula (II)
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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