STRUCTURALLY BONDED ARRANGEMENT
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
Jan 17, 2024
filing date -
Mar 16, 2023
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Abstract
A structurally bonded arrangement comprising: an interconnecting component; a first component with a first connecting area that is rigidly connected to the interconnecting component; and a second component with a second connecting area that is structurally bonded to the interconnecting component in an associated bonding area; wherein a plurality of separated sub-bondings is formed in the associated bonding area between the second component and the interconnecting component.
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