LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
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United States of America Patent
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Issued Date -
Sep 19, 2024
app pub date -
Mar 17, 2022
filing date -
Jul 5, 2021
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Abstract
A laser processing apparatus according to an embodiment includes a laser beam source, a stage, an fθ lens, a galvano scanner that scans a processed surface of a processing target with a laser beam by operating a dielectric mirror to adjust an incident angle of the laser beam with respect to the fθ lens, a polarization beam splitter disposed between the laser beam source and the galvano scanner on an optical path of the laser beam, a quarter-wave plate disposed between the polarization beam splitter and the galvano scanner on the optical path, and a light detection unit that detects a return beam of the laser beam from the processed surface irradiated with the laser beam, the return beam passing through the fθ lens, the galvano scanner, the quarter-wave plate, and the polarization beam splitter in this order.
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