EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240305376A1
SERIAL NO

18663749

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
JUNIPER NETWORKS INCCALIFORNIA USA CALIFORNIA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alleston, Steven B Los Gatos, US 10 121
Anderson, Jon J San Jose, US 38 642
Di, Mola Domenico Morgan Hill, US 21 137
Holmes, Ryan Nepean, CA 17 72
Maki, Jeffery J Dublin, US 12 149
Park, Chul Soo Dublin, US 8 14
Qu, Zhen Sunnyvale, US 18 54
Yue, Yang Milpitas, US 87 253

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation