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United States of America Patent
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Issued Date -
Sep 12, 2024
app pub date -
May 21, 2024
filing date -
Apr 30, 2015
priority date (Note) -
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Abstract
An electronic device includes a substrate, a signal line, a semiconductor, a first conductive portion and a second conductive portion. The signal line is disposed on the substrate. The semiconductor is disposed on the substrate and overlapped with the signal line. Wherein the semiconductor is electrically connected to the first conductive portion and the second conductive portion. Wherein in a top view, at least a portion of the signal line is disposed between the first conductive portion and the second conductive portion. Wherein the first conductive portion has a first curve edge, the second conductive portion has a second curve edge, and the first curve edge and the second curve edge are facing the at least a portion of the signal line and are convex toward the at least a portion of the signal line.
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