COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL
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United States of America Patent
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Issued Date -
Sep 12, 2024
app pub date -
Dec 22, 2021
filing date -
Dec 24, 2020
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Abstract
A composite material has a plate shape and has a first surface and a second surface. The second surface is opposite to the first surface. The composite material includes a plurality of first layers and at least one second layer. The first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface. Each of the first layers is a layer including copper. The second layer is a layer of a molybdenum powder compact impregnated with copper. A compressive residual stress of 50 MPa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.
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