METHOD AND APPARATUS FOR CONTROLLING WAFER TRANSFER ROBOT USING STATIC ELECTRICITY PREDICTION
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United States of America Patent
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Issued Date -
Sep 12, 2024
app pub date -
Mar 8, 2024
filing date -
Mar 9, 2023
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Abstract
The present invention relates to a method of controlling a wafer transfer robot using static electricity prediction, and the method includes acquiring, when a wafer is transported by an end effector of the wafer transfer robot, temperature and humidity data around the wafer from a temperature sensor and a humidity sensor of a static elimination system installed in a non-contact manner with the end effector of the transfer robot, predicting an electrostatic voltage by substituting the acquired data into a predetermined humidity-electrostatic voltage graph, calculating a static elimination time of the predicted electrostatic voltage, performing static elimination on the wafer during the calculated static elimination time, and adjusting a transfer speed of the transfer robot based on the calculated static elimination time.
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