LOW-K DIELECTRIC AEROGEL/POLYMER COMPOSITE FILM PREPARATION METHOD
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United States of America Patent
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Issued Date -
Sep 12, 2024
app pub date -
Mar 6, 2023
filing date -
Mar 6, 2023
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Abstract
The aerogel particles are mixed with organic solvent and dispersed to form an aerogel suspended solution containing the organic solvent, which can be uniformly aerogel/polymer solution with mixed various types of polymers or plastics solution by mixer, and then coated to form an aerogel/polymer composite film, and the steps of which comprises: organic solvent suspension dispersion, polymer solution mixing, coating film formation, drying and winding. The prepared organic solvent aerogel suspended solution can be evenly mixed with the matching polymer solution to form a uniform aerogel/polymer solution, and then the uniform aerogel/polymer solution is made into various thicknesses of aerogel/polymer composite film by the use of coating, laminating, extruding and other processes. The aerogel/polymer composite film has a thermal insulation and low-dielectric properties and can be applied in a dielectric layer of a high-frequency circuit, an insulation layer of a semiconductor device, or communication mobile phone, computer and other applications.
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