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Abstract

The present disclosure provides a ceramic package for quantum computing and a method for preparation. The ceramic package for quantum computing may include a first ceramic plate, a vacuum tube, and a second ceramic plate connected sequentially from bottom to top, wherein the first ceramic plate is installed with a first light window, the second ceramic plate is installed with a second light window, the first light window and the second light window cover a signal inlet and a signal outlet of the vacuum tube, respectively; the first ceramic plate is provided with a lead wire on a side depart from the vacuum tube and configured to lead a signal into a system. The method for preparation may include placing the first ceramic plate, the vacuum tube, the second ceramic plate, the lead wire, and the first solder sheet in a mold for positioning, and soldering the solder sheet into a sintered member by heating and melting the solder sheet; plating nickel and gold on an outer surface of the sintered member, respectively; providing a gold layer on a welding surface of the light window and a plating layer on a photon signal passage; and soldering a gold-plated sintered member to the first light window and the second light window with gold and tin through the second solder sheet, respectively, to form a ceramic package with a vacuum channel.

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First Claim