MOULDING APPARATUS
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United States of America Patent
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Issued Date -
Sep 12, 2024
app pub date -
Jul 6, 2022
filing date -
Jul 6, 2021
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Abstract
The present disclosure concerns a molding apparatus including:
- a first thermally conductive flange and a second thermally conductive flange, said first and second thermally conductive flanges delimiting a cavity configured to receive thermoplastic pre-impregnated textiles,a mold thermally conductive and thermoregulated by a heat transfer fluid—comprising an upper impression and a lower impression, said upper and lower impressions being configured to receive said first and second thermally conductive flanges.
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