SEMICONDUCTOR ON INSULATOR WAFER WITH CAVITY STRUCTURES
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United States of America Patent
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Issued Date -
Sep 5, 2024
app pub date -
May 9, 2024
filing date -
Sep 22, 2020
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to a semiconductor on insulator substrate with cavity structures and methods of manufacture. The structure includes: a bulk substrate with at least one rectilinear cavity structure; an insulator material sealing the at least one rectilinear cavity structure; and a buried insulator layer on the bulk substrate and over the at least one rectilinear cavity structure.
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