INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
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Sep 5, 2024
app pub date -
May 7, 2024
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Nov 14, 2017
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This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.
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