LIQUID METAL CONNECTION DEVICE AND METHOD
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United States of America Patent
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Issued Date -
Sep 5, 2024
app pub date -
Dec 22, 2021
filing date -
Dec 22, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.
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