HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE
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United States of America Patent
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Issued Date -
Sep 5, 2024
app pub date -
Jan 22, 2024
filing date -
Mar 3, 2023
priority date (Note) -
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Abstract
A heat transport device includes a housing, a wick, and a vapor passage. The housing has a sealed space in which a working fluid is sealed. The wick forms a capillary passage through which a liquid-phase working fluid flows inside the housing. A gas-phase working fluid flows through the vapor passage inside the housing. An outer wall of the housing has a heating element disposing portion on which a heating element is disposed, and a non-disposing portion on which a heating element is not disposed. An internal portion of the housing has a heat receiving portion overlapping with the heating element disposing portion in a thickness direction of the housing and a heat radiating portion overlapping with the non-disposing portion in the thickness direction. Both the wick and the vapor passage are provided to extend over the heat receiving portion and the heat radiating portion.
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