ELECTROSTATIC CHUCK
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United States of America Patent
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Issued Date -
Sep 5, 2024
app pub date -
May 13, 2024
filing date -
Jan 11, 2021
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Abstract
Electrostatic chucks and methods of forming electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a device embedded within the ceramic body, and an interface layer formed overlying the device. Exemplary methods include providing ceramic precursor material within a mold, providing a device, coating the device with an interface material to form a coated device, placing the coated device on or within the ceramic precursor material, and sintering the ceramic precursor material to form the electrostatic chuck and an interface layer between the device and ceramic material formed during the step of sintering.
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