HYBRID PACKAGE CHIP AND OPTICAL TRANSMITTER
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United States of America Patent
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Issued Date -
Sep 5, 2024
app pub date -
Mar 12, 2024
filing date -
Sep 18, 2021
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Abstract
A hybrid package chip and an optical transmitter includes a first sub-chip including a first waveguide and at least one first electrode, and a second sub-chip including a second waveguide and at least one second electrode. The first waveguide is optically coupled to the second waveguide. A first electrode of the first sub-chip and a corresponding second electrode of the second sub-chip are electrically connected to one another by means of a first conductive structure, so as to receive a modulation electrical signal. The first sub-chip is configured to receive external input light and output the light by means of the first waveguide. The at least one first electrode modulates the input light so as to output the modulated light. The second waveguide receives a portion of light from the first sub-chip through coupling.
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