SOLDERING APPARATUS AND SOLDERING METHOD USING SAME
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United States of America Patent
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Issued Date -
Sep 5, 2024
app pub date -
Apr 26, 2022
filing date -
Jul 9, 2021
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Abstract
A soldering apparatus and a soldering method using the same are provided. The soldering apparatus includes a light source configured to supply light radiation required for soldering; and a mask disposed on the light path of the light source and including a light-shielding portion and multiple light-transmissive portions. The multiple light-transmissive portions are spaced apart by the light-shielding portion and are configured for the light radiation to pass through. The mask has different transmittances so that the magnitude of the light power irradiated on a substrate can be controlled. Therefore, devices can not only be soldered in batches but also be prevented from being damaged caused by inconsistent requirements on light powers.
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