LASER AMPLIFICATION MEDIUM AND LASER AMPLIFICATION MEDIUM MANUFACTURING METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Feb 15, 2022
filing date -
Jun 11, 2021
priority date (Note) -
Published
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Abstract
A laser amplification medium includes: a clad part; a first core part and a second core part; a virtual first, second, and third layers. The first core part and the second core part extend parallel to an axis direction. The first layer includes the first core part, the second core part, and a part of the clad part. The second layer and the third layer include a part of the clad part. Each side face of the first core part and the second core part includes a first planar portion and a second planar portion. The first planar portion is included in a first surface of the first layer, the first surface being a virtual bonding interface with the second layer. The second planar portion is included in a second surface of the first layer, the second surface being a virtual bonding interface with the third layer.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI HEAVY INDUSTRIES LTD | 2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 1008332 JAPAN | |
RIKEN | WAKO-SHI SAITAMA 351-0198 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
HAMAMOTO, Koichi | Tokyo, JP | 32 | 50 |
# of filed Patents : 32 Total Citations : 50 | |||
OGAWA, Takayo | Saitama, JP | 8 | 2 |
# of filed Patents : 8 Total Citations : 2 | |||
WADA, Satoshi | Saitama, JP | 296 | 3471 |
# of filed Patents : 296 Total Citations : 3471 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Feb 29, 2028 |
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