Three-dimensional Heterogeneous Integrated Millimeter-wave System Package Structure
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United States of America Patent
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Aug 29, 2024
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May 8, 2024
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Jul 25, 2023
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Abstract
The present invention provides a three-dimensional heterogeneous integrated millimeter-wave system package structure, which is composed of an upper antenna board and a lower chip carrier board. The upper antenna board has an integrated structure with an antenna in package and a feed network arranged inside, the lower chip carrier board has a modular structure provided with a first chipset and a second chipset which are heterogeneous integrated, and each chipset comprises a plurality of chips of the same or different processes.
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