SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Oct 4, 2023
filing date -
Feb 24, 2023
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Abstract
A manufacturing method of a semiconductor apparatus in which a semiconductor chip is joined to a target object, the manufacturing method including forming, in a joining region between the semiconductor chip and the target object where the semiconductor chip and the target object should be joined to each other, a plurality of metal paste patterns with a gap being provided in at least a part along a thickness direction between one another, and joining the semiconductor chip and the target object by sintering the plurality of metal paste patterns sandwiched between the semiconductor chip and the target object in a state where the gap exists between one another.
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