THIN FILM CAPACITOR
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Feb 27, 2024
filing date -
Feb 28, 2023
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Abstract
Disclosed herein is a thin film capacitor that includes a capacitor part having a lower electrode, an inner electrode, and a dielectric layer positioned between the lower electrode and the inner electrode, an insulating layer covering the capacitor part, a terminal electrode provided on the insulating layer, and a plurality of via holes penetrating the insulating layer so that the terminal electrode and the inner electrode of the capacitor part are connected to each other via the plurality of via holes. The terminal electrode includes a via region on which the plurality of via holes are arranged and having a ring-shaped, and a bonding region surrounded by the via region and having flat-shaped.
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