DEVICE AND METHOD FOR PROVIDING A THERMALLY CONDUCTIVE COUPLING
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
May 8, 2024
filing date -
May 13, 2020
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Abstract
A device intended for cooling an object being moved within a cryostat comprises a heat transfer section forming a contact surface for said object and means for fastening the heat transfer section to a cooling structure in such a way that said contact surface remains free. The device comprises a spring section (which is separate from said heat transfer section and which is arranged to exert on the heat transfer section a spring force pushing said contact surface in a direction in which it is intended to contact said object.
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