ALUMINUM MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUSES, AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Sep 1, 2022
filing date -
Sep 6, 2021
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Abstract
An aluminum member for semiconductor manufacturing apparatuses (1) includes: a base material (2), which is composed of aluminum or aluminum alloy; and an anodized coating (3), which is formed on the base material (2). Heterogenous particles (31), which contain a metal atom or metal atoms other than Al atoms and the major-axis diameters of which are 0.1 μm or more and 15 μm or less, exist in the anodized coating (3). A method of manufacturing the aluminum member for semiconductor manufacturing apparatuses (1) includes an anodizing-process step, in which the anodized coating (3), which contains the heterogenous particles (31), is formed on the base material (2) by performing an anodizing process, using an acidic electrolytic solution, on the base material (2) having second-phase particles in the Al parent phase.
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