MICROSTRUCTURE SYSTEMS AND METHODS FOR PAIN TREATMENT
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United States of America Patent
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Issued Date -
Aug 29, 2024
app pub date -
Apr 18, 2024
filing date -
Feb 19, 2020
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Abstract
The present invention relates generally to devices comprising one or more microstructures that are used to relieve, treat or prevent pain. The devices are designed such that they are inserted into the superficial layers of the skin to achieve pain relief. The devices are designed such that the microstructures are able to grasp and secure to the skin. The devices may consist of microstructures in arrays that are attached to a backing to enable the devices to adhere to the skin. Also provided are wound closure systems that comprise one or more microstructure devices along with other components, such as protective covers and therapeutics. A variety of packaging specifications are disclosed, as is a dispenser apparatus configured to enable simple one-handed application of the devices. Methods described herein provide for treatment of pain.
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