SUBCARRIER WAFER, SUBCARRIER, METHOD FOR MANUFACTURING SUBCARRIER WAFER

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United States of America Patent

APP PUB NO 20240283216A1
SERIAL NO

18524024

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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What is provided is a subcarrier wafer in which chipping, particles, cracking, and the like are curbed.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATION2-5-1 NIHONBASHI CHUO-KU TOKYO 1036128 ?1036128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOYAGI, Takashi Tokyo, JP 23 268
FUKUDA, Makoto Tokyo, JP 78 786
FUKUZAKI, Ryohei Hong Kong, CN 7 1
HONDA, Takashi Tokyo, JP 222 2382
KOMAKI, Tsuyoshi Tokyo, JP 86 450

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